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Royal Technology (shenzhen) Co.,Ltd.

All Products >> manufacture

Showing 1 - 9 of 9, total 1 pages        [First] [Previous] [Next] [Last]

1
high difficulty 8 layer mobile pcb
high difficulty 8 layer mobile pcb
Specification: High difficulty 8 layer mobile PCB
Detail: FR-4+RCC £º1.0mm Surface processing:immersion gold Laser drill hole(Min.):0.1mm Buried and blind via structure:L1-L2,,L2-L7,L8-L7 Min. line ***ce: 0.1mm Min. line width: 0.1mm

2
wireless network-card board
wireless network-card board
Specification: Wireless network-card board
Detail: 6 layers HDI Material:FR-4+RCC Thickness:1.0mm Surface processing:immersion gold Laser drill hole(Min.):0.1mm Min. line ***ce: 0.1mm Min. line width: 0.1mm

3
bluetooth board
bluetooth board
Specification: Bluetooth board
Detail: 6 layers HDI FR-4+RCC Material:FR-4+RCC Thickness:0.80mm Surface processing:immersion gold Laser drill hole(Min.):0.1mm Buried and blind via structure:L1-L2,L2-L5,,L5-L6 Min. line ***ce: 0.1mm Min. line width: 0.1...

4
sd ultra-thin board
sd ultra-thin board
Specification: SD ultra-thin board
Detail: Thickness: 0.15mm Copper thickness: 0.5oz Min hold size: 0.2mm

5
hdi high difficulty 10 layer pcb
hdi high difficulty 10 layer pcb
Specification: HDI high difficulty 10 layer pcb
Detail: Material:FR-4+RCC Finish thickness: 1.6mm Surface processing:immersion gold Copper thickness:1oZ Laser drill hole(Min.):0.1mm Min. line ***ce: 0.13m Min. line width: 0.1mm

6
4 layers gold finger pcb
4 layers gold finger pcb
Specification: 4 layers gold finger
Detail: Thickness:1.6mm Min hole size:0.25mm Line width(minimum):6mil Line ***ce(minimum):6mil RoHS PCB Production Surface treament:immersion gold

7
6 layers pcb
6 layers pcb
Specification: 6 layers,ENIG,buried and blind of Use to keyboarmobile telephone
Detail: RoHS PCB Production Layers:6 blind and buried board Material:FR4 Thickness:1.6mm Copper:1oz Surface treament:immersion gold Solder mask:green

8
8 layers pcb
8 layers pcb
Specification: 8 layers,ENIG,buried and blind of Use to mobile telephone
Detail: Material:FR4 With blind and buried holes(L1-L2,L2-L3,L7-L8,L2-L7) Surface treament:immersion gold Solder mask:green Min hole size:0.1mm Track ***ce:0.1mm

9
1layer-fr4-hal pcb
1layer-fr4-hal pcb
Specification: 1layer-fr4-hal PCB
Detail: Specifictions: Layers:1 Material:FR4 Thickness:1.6mm Surface processing:HAL Minimum drill hole:0.3mm Line width(minimum):6mm Line ***ce(minimum):6mm RoHS compliance
Showing 1 - 9 of 9, total 1 pages        [First] [Previous] [Next] [Last]
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